Q&T Presents PolyShielded™ at HSP Asia 2025

Q&T Hi-Tech Polymer participated in High Security Printing Asia 2025, held from 1–3 December 2025 in Kuala Lumpur, Malaysia.

During the conference, Q&T presented PolyShielded™, its embedded-security polymer substrate architecture, with a focus on integrating optical security features within the polymer structure rather than applying them only to the surface.

The Challenge of Surface-Applied Security Features

Q&T’s presentation highlighted several challenges associated with surface-applied security features.

Because these elements remain exposed on the exterior of the banknote, they can be affected by wear, moisture and chemical exposure during circulation.

The presentation positioned embedded security as an alternative architecture intended to provide greater physical protection for selected optical features.

Design and Integration

The HSP Asia presentation also highlighted the potential for embedded security elements to be integrated across broader areas of the substrate rather than being restricted to conventional surface patches or windows.

This approach can support more continuous design integration and allow downstream printing to interact more closely with embedded security areas.

Continuing Industry Engagement

Q&T’s participation at HSP Asia 2025 formed part of the company’s wider engagement with the international banknote and high-security printing community.

The conference provided an opportunity to present the PolyShielded™ concept and discuss embedded-security approaches with industry participants.