Q&T Presents Embedded-Security Polymer Technology at Currency Conference 2025

Q&T Hi-Tech Polymer participated in Currency Conference 2025, held from 26–29 May in Bangkok, Thailand.

During the conference, Q&T presented its embedded-security polymer substrate technology, introducing an approach that places selected optically variable devices within the multilayer polymer structure rather than applying them only to the finished surface.

Introducing an Embedded-Security Architecture

The technology presented by Q&T uses a multilayer polymer architecture in which selected optical security features can be positioned within the substrate structure.

The approach is intended to reduce direct exposure of the optical feature to abrasion, folding, moisture and other circulation-related stresses while maintaining its role as a visible security element.

Two OVD Integration Approaches

Q&T presented two routes for incorporating optical security features within the polymer substrate.

One approach uses hot-stamped OVD foil applied to a polymer laminate before final lamination.

The second uses UV cast-and-cure technology to form an optical microstructure on a polymer layer before subsequent processing and lamination.

Both approaches can support different embedded feature formats, including patches and stripes.

Demonstration Samples

Demonstration samples presented by Q&T included an embedded UV cast-and-cure OVD patch and an embedded demetallised KINEGRAM® registered stripe.

The samples illustrated how different optical technologies could be incorporated within the multilayer polymer substrate architecture.

Continuing Development

The Currency Conference presentation marked an important public demonstration of Q&T’s work on embedded optical security for polymer banknotes.

Q&T has continued developing this area through subsequent technical demonstrations, industry events and cooperation with optical-security technology partners.