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Contract Signing Ceremony For The Supply of Security Printing Substrate B06/2025

Q&T Hi-Tech Polymer

14 Mar 2025

Q&T and TFS Consortium Secure Strategic Contract for Security Printing Substrate B06/2025

On March 14, 2025, the National Banknote Printing Plant held a formal ceremony to sign the contract for supplying security printing substrate B06. This contract falls under tender package VTC 25-02, with the Q&T and TFS Consortium as the successful bidder. Contract number 09/2025/NBPP-QT-TFS/B06 was signed in accordance with current regulations on contractor selection.


This event signifies a new milestone in the partnership between the National Banknote Printing Plant and its strategic partners, reinforcing a commitment to conducting projects transparently and professionally.


This achievement reinforces Q&T’s position as a trusted leader in the field, and we remain committed to driving success through collaboration and forward-thinking solutions.

© 2024 by Q&T Hi-tech Polymer. 

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