
Contract Signing Ceremony For The Supply of Security Printing Substrate B06/2025

Q&T Hi-Tech Polymer
14 Mar 2025
Q&T and TFS Consortium Secure Strategic Contract for Security Printing Substrate B06/2025
On March 14, 2025, the National Banknote Printing Plant held a formal ceremony to sign the contract for supplying security printing substrate B06. This contract falls under tender package VTC 25-02, with the Q&T and TFS Consortium as the successful bidder. Contract number 09/2025/NBPP-QT-TFS/B06 was signed in accordance with current regulations on contractor selection.
This event signifies a new milestone in the partnership between the National Banknote Printing Plant and its strategic partners, reinforcing a commitment to conducting projects transparently and professionally.
This achievement reinforces Q&T’s position as a trusted leader in the field, and we remain committed to driving success through collaboration and forward-thinking solutions.